Contribute to the development of high-functionality, lightweight, and high-precision technologyCeramic Components for Semiconductor Processing
Catalog Overviews
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        Fine ceramic components used in semiconductor manufacturing equipment
The performance of semiconductors continues to improve and their applications continue to expand. The various manufacturing equipment that  produces them is required to respond to technological trends such as miniaturization of wiring and multi-layering, all while achieving higher productivity.  For this reason, lithography equipment components require high-precision parts made of lightweight and rigid materials, and etching and deposition equipment components require plasma resistance and low particles. Also, they may require heat resistance of 600 degree C or higher or low dielectric loss. All  of these demands have led to an increased use of ceramics. Kyocera’s Fine Ceramic products with high-precision and excellent mechanical properties are widely used  in inspection equipment such as probers, wafer cutters, back grinders, and wafer transfer arms. In addition, sapphire is used for such applications as windows that require optical transparency, wafer carrier plates, wafer contact lift pins, and plasma introduction tubes.
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        Product Examples
Wafer Manufacturing Process
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Alumina Wafer Polishing Plate / Turn Table -  
                
Silicon Carbide Wafer Polishing Plate -  
                
Pad Dresser -  
                
Sapphire Carrier Plate 
Device Manufacturing Process
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Plasma Proof Dome -  
                
Plasma Proof Ring -  
                
End Effector -  
                
Chamber Window & Tube 
Epoch-making Technologies
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Metalized Products - Metal Assembly Technology -  
                
Coating Technology 
Index of Catalog
The catalog introduces the following material properties and product examples. Download the PDF to learn more.
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              TechnologiesDesign & Simulation Technology / Analysis Technology / evalsuation Technology
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              Material PropertiesMaterial Characteristics Table
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              Products[ Wafer Manufacturing Process ]
Alumina Wafer Polishing Plate / Silicon Carbide Wafer Polishing Plate / Pad Dresser / Sapphire Carrier Plate
[ Device Manufacturing Process ]
Plasma Proof Dome / Plasma Proof Ring / Electro-Static Chuck / Heater / Vacuum Chuck / Nozzle / End Effector
[ Epoch-making Technologies ]
USM Stage - Assembly Technology / Metalized Products - Metal Assembly Technology / Coating Technology / Material Development Technology 















