Technology for Bonding Metals to Ceramics

Kyocera develops advanced technologies to bond ceramics and metals using brazing materials and glass.
This bonding technology is used to attach pins and leads for board-level assembly, seal rings to enable hermetic sealing, and heat-spreader metals to enhance thermal dissipation.

Why Bond Dissimilar Materials ?

• To support multiple board-level assembly options
• To enable hermetic sealing via seam welding
• To improve heat dissipation via heat spreader

Brazing Metals

When packages require hermetic sealing, Kyocera conducts hermeticity testing after brazing to confirm before shipping.

Glass Sealing

Low-dielectric-constant glass serves as a bonding material to support high-frequency applications.