Plating Technologies for Multilayer Ceramic Packages
Kyocera can propose optimal plating specifications, including thickness and processing methods, based on the package design and your assembly methods and processes.
Plating Process Options
- Electrolytic process
- Electroless process
Plating Metal Options
- Ni-Au (standard specification)
- Ni-Pd-Au
Plating Specifications for Thin-Film Packages
Thin-film packages offer more conductor and plating options than co-fired ceramic packages.
Plating Process Options
- Electrolytic process
- Electroless process
Plating Metal Options
- Au
- Ni-Au
- Ni-Pd-Au
- Cu
Optimal plating specifications and methods vary depending on thin-film composition. Please contact us for details.
Other Key Technologies Supporting Innovation
Thin-Film Technology
Ceramic Package Features and Basic Structure
Wiring Technology: (Thick / Thin Film)
Integrated Simulation Capabilities
Material Options
Bonding Dissimilar Materials
Offering a Wide Variety of Package Designs and Structures
Co-Firing Technology
3D Structures / 3D Electrical Interconnects
Customized Optical Window Lid Design
Product Categories
Solutions